Light emitting device and lighting apparatus having the same

ABSTRACT

Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having reflectance, disposed on top surfaces of the lead frames and having an open region at a predetermined region of the top surfaces of the lead frames, a second body having transmittance, having a first opening corresponding to the open region of the first body, and disposed on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first resin layer disposed in the first opening of the second body to cover the light emitting chip.

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application No. 10-2011-0119822 filed on Nov. 16, 2011,which is hereby incorporated by reference in its entirety.

BACKGROUND

The embodiment relates to a light emitting device and a lightingapparatus including the same.

Light emitting devices, for example, light emitting diodes (LEDs) aresemiconductor devices that convert electric energy into light andextensively used as next-generation light sources in place ofconventional fluorescent lamps and glow lamps.

Since the LED generates the light by using the semiconductor device, theLED may represent low power consumption as compared with the glow lampthat generates the light by heating tungsten or the fluorescent lampthat generates the light by urging ultraviolet ray, which is generatedthrough the high-voltage discharge, to collide with a phosphor.

In addition, the LED generates the light by using the potential gap ofthe semiconductor device, so the LED is advantageous as compared withconventional light sources in terms of life span, responsecharacteristics and environmental-friendly requirement.

In this regard, various studies have been performed to replace theconventional light sources with the LEDs. The LEDs are increasingly usedas light sources for lighting devices, such as various lamps usedindoors and outdoors, liquid crystal displays, electric signboards, andstreet lamps.

SUMMARY

The embodiment provides a light emitting apparatus having a wide lightorientation angle.

The embodiment provides a light emitting apparatus including a firstbody having a higher reflectance than transmittance around a lightemitting chip and a second body having a higher transmittance thanreflectance on the first body.

The embodiment provides a light emitting device including a second bodyrepresenting transmittance around a light emitting chip and an opticallens having a concave part and a total reflection surface concavedtoward the light emitting chip on the light emitting chip.

The embodiment provides a lighting apparatus having the light emittingdevice.

According to the embodiment, the light emitting device includes aplurality of lead frames, a first body having a higher reflectance thantransmittance, disposed on top surfaces of the plurality lead frames andhaving an open region at a predetermined region of the top surfaces ofthe plurality of lead frames, a second body having a highertransmittance than reflectance, having a first opening corresponding tothe open region of the first body, and disposed on a top surface of thefirst body, a light emitting chip on at least one of the lead framesexposed in the first opening of the second body, and a first resin layerdisposed in the first opening of the second body to cover the lightemitting chip.

According to the embodiment, the light emitting device includes a firstlead frame having a cavity, a second lead frame spaced apart from thefirst lead frame, a first body having a higher reflectance thantransmittance, disposed on the first and second lead frames, andexposing a predetermined region of top surfaces of the first and secondlead frames, a second body having a higher transmittance thanreflectance and having a first opening corresponding to a central regionof the first body, and disposed on a top surface of the first body, alight emitting chip disposed in a cavity of the first lead frame andelectrically connected to the first and second lead frames, and a firstresin layer in the cavity.

According to the embodiment, there is provided a lighting apparatusincluding the light emitting device, a module substrate having the lightemitting device arrayed thereon, and an optical member on at least oneside of the light emitting device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment;

FIG. 2 is a sectional view taken along line A-A of the light emittingdevice shown in FIG. 1;

FIG. 3 is a sectional view taken along line B-B of the light emittingdevice shown in FIG. 1;

FIG. 4 is a sectional view taken along line C-C of the light emittingdevice shown in FIG. 1;

FIG. 5 is a perspective view showing a lead frame in the light emittingdevice shown in FIG. 2;

FIG. 6 is a view showing the assembling of the lead frame and the firstbody in the light emitting device shown in FIG. 2;

FIG. 7 is a view showing the assembling of the first and second bodiesin the light emitting device of FIG. 2;

FIG. 8 is a view showing the height of the top surface of the first bodyand the inclination angle of the first body in the light emitting deviceshown in FIG. 2;

FIG. 9 is a side sectional view showing a light emitting deviceaccording to a second embodiment;

FIG. 10 is a side sectional view showing a light emitting deviceaccording to a third embodiment;

FIG. 11 is a side sectional view showing a light emitting deviceaccording to a fourth embodiment;

FIG. 12 is a side sectional view showing a light emitting deviceaccording to a fifth embodiment;

FIG. 13 is a side sectional view showing a light emitting deviceaccording to a sixth embodiment;

FIG. 14 is a side sectional view showing a light emitting deviceaccording to a seventh embodiment;

FIG. 15 is a view showing a light orientation angle of the lightemitting device of FIG. 2.

FIG. 16 is a sectional view showing one example of a light emitting chipin a light emitting device according to the embodiment;

FIG. 17 is a sectional view showing another example of a light emittingchip in a light emitting device according to the embodiment;

FIG. 18 is a perspective view showing a display apparatus having thelight emitting device according to the embodiment;

FIG. 19 is a sectional view showing a display apparatus according to theembodiment; and

FIG. 20 is a perspective view of a lighting unit with the light emittingdevice.

FIG. 21 is an exploded perspective view showing another example of alighting unit having the light emitting device according to theembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, when a predetermined part “includes” apredetermined component, the predetermined part does not exclude othercomponents, but may further include other components unless otherwiseindicated. In the description of the embodiments, it will be understoodthat when a layer, a film, a region, or a plate is referred to as being“on” another layer, another film, another region, or another plate, itcan be “directly” or “indirectly” on the other layer, other film, otherregion, other plate, or one or more intervening layers may also bepresent. In contrast, when a part is referred to as being “directly on”another part, the intervening layer is not present.

The thickness and size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size. The same reference numbers will beassigned the same elements throughout the drawings.

FIG. 1 is a perspective view showing a light emitting device accordingto a first embodiment, FIG. 2 is a sectional view taken along line A-Aof the light emitting device shown in FIG. 1, and FIG. 3 is a sectionalview taken along line B-B of the light emitting device shown in FIG. 1.FIG. 4 is a sectional view taken along line C-C of the light emittingdevice shown in FIG. 1, and FIG. 5 is a perspective view showing a leadframe in the light emitting device shown in FIG. 2.

Referring to FIGS. 1 to 5, a light emitting device 100 includes aplurality of lead frames 121 and 131 spaced apart from each other, afirst body 141 having an open upper region and formed on the lead frames121 and 131, a second body 151 having a first opening 150, disposed onthe first body 141, and including a material different from that of thefirst body 141, a light emitting chip 161 disposed at least one of thelead frames 121 and 131 exposed through the first opening 150, a resinlayer 171 surrounding the light emitting chip 161 at the first opening150, and an optical lens 181 disposed on the resin layer 171 and thesecond body 151.

As shown in FIG. 1, in the light emitting device 100, a first directionX may be defined as a direction of a length D4, a second direction Zperpendicular to the first direction X may be defined as a direction ofa width D3, and a direction Y perpendicular to the top surface of thelight emitting chip 161 may be defined as an optical axis direction, ora perpendicular line direction of the light emitting chip 161.

The length D4 of the light emitting device 100 may be an intervalbetween outer surfaces of the lead frames 121 and 131. The length D4 ofthe light emitting device 100 may be the interval between both lateralsides S1 and S2 of the first body 141. In this case, the outer surfacesof the lead frames 121 and 131 may not protrude toward both lateralsides S1 and S2 of the first body 141. Both end portions of the leadframes 121 and 131 may protrude beyond both lateral sides S1 and S2 ofthe first body 141 for the adhesion with an adhesive member (not shown)with solder paste. The length D2 of the first body 141 may be theinterval between both lateral sides S1 and S2, and may be shorter thanor equal to the length D4 of the light emitting device 100.

The width of the light emitting device 100 may be the width D3 of thefirst body 141, and the width D3 of the first body 141 may be wider thanthe width D1 of each of the lead frames 121 and 131. If the width D3 ofthe first body 141 is wider than the width D1 of each of the lead frames121 and 131, each of the lead frames 121 and 131 may not be exposed, andmoisture can be prevented from being infiltrated. In addition, the topsurface of the first body 141 reflects light, so that the orientationangle of light may be increased.

The lead frames 121 and 131 include the first lead frame 121 and thesecond lead frame 131 as shown in FIGS. 2 and 5. The first lead frame121 includes a first groove 123 and a first hole 122. The first groove123 may be formed by a preset depth from the top surface of the firstlead frame 121, and defined at a peripheral portion of a chip region A1,wherein the chip region A1 includes a bonding region of the lightemitting chip 161. In this case, the peripheral portion of the chipregion A1 may be a region between the chip region A1 and one lateralside of the first lead frame 121, between the chip region A1 and twolateral sides or more of the first lead frame 121. A depth of the firstgroove 123 may be lower than the thickness of the first lead frame 121without the first groove 123, or may be equal to the depth of anothergroove. This represents that a bottom portion of the first lead frame121 opposite to the first groove 123 may be flat or protrude. A thirdcoupling portion 145 of the first body 141 may be coupled with the firstgroove 123.

A plurality of first holes 122 are arranged while being spaced apartfrom each other. The holes 122 are disposed between the first groove 123and lateral sides of the first lead frame 121. A material of the firstbody 141 may be filled in each first hole 122.

The second lead frame 131 includes a second groove 133 and a second hole132. The second groove 133 may have a preset depth, and may be formed ina direction of the width D1 of the second lead frame 131. In addition,the length of the second groove 133 may be greater than a length D12 ofthe second lead frame 131. The width of the second groove 133 may bewider than a width G1 of a space, that is, a gap to fill the first body141. The second groove 133 may be formed at an outside of a bondingregion A2. In other words, the second groove 133 may be formedcorresponding to the first lead frame 121. A plurality of second holes132 are arranged at an outside of the second groove 133 while beingspaced apart from each other by a predetermined distance. The secondgroove 133 and the second hole 132 may be filled with a materialconstituting the first body 141. A depth of the second groove 133 may belower than the thickness of the second lead frame 131 without the secondgroove 133, or may be equal to that of the second lead frame 131 inother regions. This may represent that a bottom portion of the secondlead frame 131 opposite to the second groove 133 may be flat orprotrude.

One or at least two of the first holes 122 and the second holes 132 maybe formed with a width having a wider low portion and a narrower upperportion as shown in FIG. 2, but the embodiment is not limited thereto.At least one of the first hole 122, the second hole 132, the firstgroove 123, and the second groove 133 may not be formed in the first andsecond lead frames 121 and 131, but the embodiment is not limitedthereto. In addition, a plurality of the first and second grooves 123and 133 may spaced apart from each other in the lead frames 121 and 131,but the embodiment is not limited thereto.

A first end portion 124 of the first lead frame 121 corresponds to asecond end portion 134 of the second lead frame 131. The first endportion 124 may protrude from a lateral side of the first lead frame 121toward the second end portion 134, and the second end portion 134 mayprotrude from the lateral side of the second lead frame 131 toward thefirst end portion 124. A gap 115 between the first and second leadframes 121 and 131 is an interval G1, and may be wider than the intervalbetween the first and second end portions 124 and 134. As the intervalbetween the first end portion 124 of the first lead frame 121 and thesecond end portion 134 of the second lead frame 131 is reduced, thebonding space of a light emitting chip 161, a first wire 166, and asecond wire 167 can be ensured. Alternatively, the first and second endportions 124 and 134 may not protrude. In this case, the interval G1 ofthe gap 115 may be constant.

The first lead frame 121 includes a first step structure 128 recessed atthe first end portion 124 and at a lateral side of the first lead frame121. The first step structure 128 may be formed by etching a presetregion of the bottom surface of the first lead frame 121. For example,the first step structure 128 may be recessed by etching the bottomsurface of the first end portion 124, and the bottom surfaces of lateralside portions of the first lead frame 121 adjacent to third and fourthlateral sides S3 and S4 of the first body 141. The first step structure128 may be formed in at least one lateral side of the bottom surface ofthe first lead frame 121, but the embodiment is not limited thereto.

The second lead frame 131 includes a second step structure 138 recessedat the first end portion 134 and at a lateral side of the second leadframe 131. The second step structure 138 may be recessed by etching apreset region of the bottom surface of the second lead frame 131. Forexample, the second step structure 138 may be formed by etching thebottom surface of the second end portion 134 of the second lead frame131, and the bottom surfaces of lateral side portions of the first leadframe 121 adjacent to third and fourth lateral sides S3 and S4 of thefirst body 141. However, the embodiment is not limited thereto.

The material constituting the first body 141 is filled in the first andsecond step structures 128 and 138, thereby preventing moisture frombeing infiltrated, and supporting the coupling of the first body 141.When comparing with regions without the first and second step structures128 and 138, the area of the bottom surface of each lead frame 121 or131 may be wider than the area of the top surface of each lead frame 121or 131.

Although the first embodiment has been described in that two lead framesare employed, three lead frames or more may be formed. In addition, whenviewed from the top, the first and second lead frames 121 and 131 mayhave a rectangular shape or another shape. In addition, at least aportion of the lead frames 121 and 131 may be bent, but the embodimentis not limited thereto.

A width D11 of the first lead frame 121 may be longer than a width D12of the second lead frame 131. The area of the top surface of the firstlead frame 121 may be wider than the area of the top surface of thesecond lead frame 131 because a light emitting chip is disposed on thefirst lead frame 121.

The first and second lead frames 121 and 131 include a metallicmaterial, for example, at least one of titanium (Ti), copper (Cu),nickel (Ni), gold (Au), chrome (Cr), tantalum (Ta), platinum (Pt), tin(Sn), silver (Ag), and phosphorus (P). The first and second lead frames121 and 131 may include a single metallic layer or different metalliclayers, but the embodiment is not limited thereto.

As shown in FIGS. 2, 3, 5, and 6, the first body 141 is formed on thefirst and second lead frames 121 and 131. The first body 141 physicallyspaces the first lead frame 121 apart from the second lead frame 131,and fixedly supports the first and second lead frames 121 and 131.

The first body 141 may be filled in the first and second grooves 123 and133 of the first and second lead frames 121 and 131, the first andsecond holes 122 and 132 of the first and second lead frames 121 and131, and the gap between the first and second lead frames 121 and 131.In addition, the first body 141 may be formed at a predeterminedthickness on the top surfaces of the first and second lead frames 121and 131. The bottom surface of the first body 141 may be aligned in linewith the bottom surfaces of the first and second lead frames 121 and131. The top surface 147 of the first body 141 may be disposed higherthan the top surfaces of the first and second lead frames 121 and 131.

The first body 141 may include a material representing reflectancehigher than transmittance with respect to the wavelength emitted fromthe light emitting chip 161. For example, the first body 141 may includea material representing at least 70% of reflectance. If the materialconstituting the first body 141 has at least 70% of reflectance, thematerial constituting the first body 141 may include a reflectivematerial or a non-transmissive material. The first body 141 may includean insulating material based on resin, for example, may include resinmaterial such as polyphthalamide (PPA). Alternatively, the first body141 may include thermal setting resin including silicon, epoxy resin,thermosetting resin such as a plastic material, a high heat resistancematerial, or a high light resistance material. If the first body 141includes silicon or epoxy, the first body 141 includes white resinhaving a metallic oxide. The metallic oxide includes a material such asTiO₂, SiO₂, or Al₂O₃.

In addition, the first body 141 may selectively include acid anhydride,an antioxidant, a release agent, an optical reflector, an inorganicfilling agent, a curing catalyst, a light stabilizer, a lubricant, or atitanium dioxide.

The first body 141 may be molded by using at least one selected from thegroup consisting of epoxy resin, modified epoxy resin, silicon resin,modified silicon resin, acrylic resin, and urethane resin. For instance,the first body 141 can be formed by using B-stage solid epoxy resincomposition, which can be obtained by mixing the epoxy resin, such astriglycidylisocyanurate or hydride bisphenol A diglycidylether, with theacid anhydride promoter, such as hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride or 4-methyl hexahydro phthalic anhydride,and then partially hardening the mixture after adding DBU(1.8-Diazabicyclo(5,4,0)undecene-7) serving as a hardening acceleratorand ethylene glycol, titanium oxide pigment or glass fiber serving as apromoter to the epoxy resin, but the embodiment is not limited thereto.

In addition, a light shielding material or a dispersing agent is addedin the first body 141, thereby reducing transmitting light. In addition,in order to have a predetermined function, the first body 141 includesat least one selected from the group consisting of a dispersing agent,pigments, phosphors, reflective materials, light shielding materials, alight stabilizer, and a lubricant mixed with thermal setting resin.

The area of the top surface 147 of the first body 141 may be greaterthan the area of the bottom surface of the second body 151. The firstbody 141 supports the second body 151 disposed on the top surface 147.The top surface 147 of the first body 141 can effectively reflect theincident light, which is more widely than the bottom surface of thesecond body 151, under the bottom surface of the second body 151.Accordingly, the light loss can be reduced, and the light extractionefficiency can be increased.

Referring to FIGS. 6 and 8, a portion of the first body 141 under thetop surface of the lead frames 121 and 131 is defined as a lower portionof the first body 141, and a portion of the first body 141 on the topsurface of the lead frames 121 and 131 is defined as an upper portion ofthe first body 141. In addition, the first body 141 may be divided intoan inner region B1 and an outer region B2. The inner region B1 is closeto the light emitting chip 161 or/and the open region 150-1. The outerregion B2 is provided at the outside of the inner region B1, andadjacent to an outer surface of the first body 141.

The top surface of the inner region B1 of the first body 141 may have aninclined surface, a convex surface, or a concave surface. The height ofthe top surface of the inner region B1 may be lower than the height ofthe top surface of the light emitting chip 161. In this case, a portionof the inner region B1 adjacent to the outer region B2 may have athickness thicker than the thickness of a portion of the inner region B1adjacent to the open region 150-1. The thickness of the inner region B1may be an interval between the top surface of the lead frame 121 and 131and the top surface of the inner region B1. The portion of the innerregion B1 adjacent to the outer region B2 may have a maximum thicknessin the inner region B1 and the portion of the inner region B1 adjacentto the open region 150-1 may have a minimum thickness in the innerregion B1.

On the assumption that the thickness of the inner region B1 is equal tothe interval between the top surface of each of the lead frames 121 and131 and the top surface of the inner region B1, the thickness of theinner region B1 is gradually increased outward from the light emittingchip 161. The top surface of the outer region B2 extends from the innerregion B1, and the outer region B2 has a thickness T1 thicker than thatof the inner region B1 with respect to the top surfaces of the first andsecond lead frames 121 and 131. The thickness T1 of the outer region B2is equal to the interval between the top surface of each lead frame 121or 131 and the top surface of the outer region B2 as shown in FIG. 8.The top surface of the outer region B2 may have a flat surface, aninclined surface having a thickness gradually increased outward from thelight emitting chip 161, a convex surface, or a concave surface. In thiscase, the convex structure is a structure protruding upward from anoptical axis of the light emitting chip 161, and the concave structureis a structure recessed downward from the optical axis of the lightemitting chip 161.

The maximum interval between the top surface 147 of the first body 141and the top surface of the lead frame 121 or 131 is a thickness T1 ofthe outer region B2 of the first body 141, and the thickness T1 may beat least 50 μm, for example, may be in the range of 50 μm to 300 μm. Theouter region B2 of the first body 141 may be the thickest region in thefirst body 141. In addition, the top surface 147 of the first body 141may be aligned on a horizontally extending line from the top surface ofthe light emitting chip 161, or may make an interval (T2-T1) of at leastLam from the horizontally extending line from the top surface of thelight emitting chip 161. Accordingly, the light emitted from the lightemitting chip 161 can be effectively reflected. The thickness of theinner region B1 is thinner than the thickness T2 of the outer region B2,so that second light L2 horizontally directed from the light emittingchip 161 can be effectively reflected. In this case, the thickness T2 ofthe light emitting chip 161 may be in the range of 80 μm to 500 μm, forexample, may be in the range of 80 μm to 150 μm, but the embodiment isnot limited thereto.

The top surface of the inner region B1 of the first body 141 is inclinedat a predetermined angle with respect to the top surface of the leadframe 121 or 131. For example, the top surface of the inner region B1may be inclined at an angle of 1° to 25° with respect to the top surfaceof the lead frame 121 or 131.

The top surface of the outer region B2 may be parallel to the topsurface of the lead frame 121 or 131. In this case, an angle between anextending line X1 from the top surface of the inner region B1 of thefirst body 141 and a perpendicular line Y1 perpendicular to the topsurface of the light emitting chip 161 may be 89° or less, for example,may be in the range of 65° to 89°. In addition, the top surface of theinner region B1 of the first body 141 may have an angle of 135° to 180°.The light orientation angle of the light emitting device can be adjustedaccording to the angle between the extending line X1 from the topsurface of the inner region B1 of the first body 141 and theperpendicular line Y1 perpendicular to the top surface of the lightemitting chip 161.

As shown in FIGS. 2 and 6, the first body 141 includes a gap part 142,and first to fourth coupling parts 143, 144, 145, and 146. The gap part142 is disposed at the gap 115 between the first lead frame 121 and thesecond lead frame 131. The width of the lower portion of the gap part142 may be wider than that of the upper portion of the gap part 142. Thetop surface of the gap part 142 may be arranged in line with the topsurface of the lead frame 121 or 131, or may protrude higher than thetop surface of the lead frame 121 or 131. In this case, if the topsurface of the gap part 142 protrudes higher than the top surfaces ofthe first and second lead frames 121 and 131, the upper portion of thegap part 142 is formed higher than the top surface of the first endportion 124 of the first lead frame 121 and the top surface of thesecond end portion 134 of the second lead frame 131, thereby preventingmoisture from being infiltrated.

The first coupling part 143 is formed in the first hole 122 of the firstlead frame 121, and the second coupling part 144 is formed in the secondhole 132 of the second lead frame 131. The third coupling part 145 isformed in the first groove 123 of the first lead frame 121, and thefourth coupling part 146 is formed in the second groove 133 of thesecond lead frame 131. The first body 141 may be securely coupled withthe first and second lead frames 121 and 131 through the gap part 142and the coupling parts 143, 144, 145, and 146.

The first body 141 includes the open region 150-1 having an open upperportion, and the open region 150-1 may be formed inside the third andfourth coupling parts 145 and 146. In other words, the first and secondgrooves 123 and 133 may form boundary regions of the open region 150-1of the first body 141. The third and fourth coupling parts 145 and 146are formed in the first and second grooves 123 and 133 of the secondlead frame 131, and the top surfaces of the third and fourth couplingparts 145 and 146 may be inclined, may have a step difference, or may beflat surface.

As shown in FIGS. 6 and 7, an inner side portion 148 of the first body141 more extends from the first groove 123 of the first lead frame 121toward the open region 150-1 to increase the contact area of an innerside portion 152A of the second body 151. In addition, since the firstand second bodies 141 and 151 are coupled with each other, the strengthof the first and second bodies 141 and 151 can be improved.

The first body 141 is a member to effectively reflect light of the lightemitting chip 161, and may include a resin mold. The first body 141includes the region 150-1 having an open central region. The topsurfaces of the first and second lead frames 121 and 131 may be exposedthrough the open region 150-1. The open region 150-1 may have a circularshape or a polygonal shape. In addition, a portion of the open region150-1 may have a curved shape. The first body 141 may have asubstantially rectangular shape. An outer peripheral portion of thefirst body 141 may be formed in a polygonal shape when viewed from thetop. Although the first body 141 has a rectangular shape, the first body141 may have an oval shape, a circular shape, or another polygonal shapewhen viewed from the top.

As shown in FIGS. 1 and 2, the first body 141 may include the first andsecond lateral sides S1 and S2, which are opposite to each other, andthe third and fourth lateral sides S3 and S4 which are adjacent to thefirst and second lateral sides S1 and S2 and opposite to each other. Thecorner of each of the first to fourth lateral sides S1 to S4 may have anangled surface or a curved surface.

An outer portion of the first lead frame 121 protrudes from the firstlateral side S1 of the first body 141, and an outer portion of thesecond lead frame 131 protrudes from the second lateral side S2. Asshown in FIGS. 1 and 4, the third and fourth lateral sides S3 and S4 ofthe first body 141 are formed outward beyond the outer portions of thefirst and second lead frames 121 and 131. Outer portions 149constituting the third and fourth lateral sides S3 and S4 of the firstbody 141 cover the outer surfaces of the first and second lead frames121 and 131. The lower end portions 149A of the outer portions 149extend along the bottom surfaces of the first and second lead frames 121and 131 from the outer portions 149 of the first body 141 may be coupledwith the step structures 128 and 138 formed as shown in FIG. 5.

As shown in FIG. 2, the second body 151 may be formed on the first body141. The second body 151 may include a transmissive material. Forexample, the second body 151 may include silicon-based resin orepoxy-based resin. The second body 151 may be formed through aninjection molding scheme, and may include a transparent material.Accordingly, the second body 151 allows first and second lights L1 andL2 emitted from the light emitting chip 161 to effectively passtherethrough.

An outer surface S5 of the second body 151 may be disposed inward from alight exit surface 182 of the optical lens 181, and may make contactwith the inner part of the light exit surface 182 of the optical lens181. Accordingly, the coupling strength between the second body 151 andthe optical lens 181 may be increased. The second body 151 may have acircular shape when viewed from the top. Alternatively, the second body151 may have a polygonal shape or an oval shape when viewed from thetop, but the embodiment is not limited thereto. The outer surface S5 ofthe second body 151 may be a light exit region. In addition, the outersurface S5 of the second body 151 may be a surface inclined orperpendicular to the top surfaces of the first and second lead frames121 and 131. Alternatively, the outer surface S5 of the second body 151may have a curved surface, for example, may have a semispherical shape.The curved outer surface can provide a wider light exit surface.

The width of the second body 151 may be less than the width D3 of thefirst body 141 as shown in FIG. 1. Alternatively, the width of thesecond body 151 may be equal to or greater than the width D3 of thefirst body 141. Accordingly, the contact area between the first andsecond bodies 141 and 151 is increased, thereby preventing moisture frombeing infiltrated into the interfacial surface between the first andsecond bodies 141 and 151 including different materials, and improvingthe reliability for the bonding in the interfacial surface between thefirst and second bodies 141 and 151.

The second body 151 includes a second thermosetting resin representingat least 70% of the transmittance with respect to the wavelength emittedfrom the light emitting chip 161. The second thermosetting resin mayinclude at least one selected from the group of silicon resin,transmissive epoxy resin, modified epoxy resin, transmissive siliconresin, modified silicon resin, acrylate resin, and urethane resin. Thesecond body 151 includes the mixture of the second thermosetting resinand at least one selected from the group consisting of a filler, adispersing agent, figments, a phosphor, and a reflective material inorder to have a predetermined function. In addition, the secondthermosetting resin may contain a dispersing agent. For example, thedispersing agent may preferably include barium titanate, titanium oxide,aluminum oxide, and silicon oxide.

As shown in FIGS. 6 and 7, the second body 151 has the first opening150, and the first opening 150 has an open upper portion to expose aportion of the lead frames 121 and 131. The first opening 150 mayinclude a chip region A1 and a bonding region A2 of FIG. 5.

The first opening 150 may have a width narrower than a width of the openregion 150-1 of the first body 141. An inner lateral side 152 of thesecond body 151 may be perpendicular to the top surface of the firstlead frame 121 or the second lead frame 131, or may be inclined at anangle of 90° to 180°.

An inner lateral side 152A of the second body 151 may be closer to thelight emitting chip 161 than an inner lateral side 148 of the first body141, and may be make contact with the top surfaces of the lead frames121 and 131. In addition, the inner lateral side 152A of the second body151 makes contact with the top surface of the first body 141 to increasethe adhesive strength with the first body 141. The structure can preventmoisture from efficiently being infiltrated.

The inner lateral side 152 of the second body 151 becomes thecircumferential surface of the first opening 150. The height of theinner lateral side 152 of the second body 151 may be thicker than thethickness of the light emitting chip 161, and may be higher than highpoints of wires 166 and 167 of FIG. 2. For example, the thickness of theinner lateral side 152 may be in the range of about 250 μm to 500 μm,but the embodiment is not limited thereto. When viewed from the top, thefirst opening 150 may have an X-axial length X and a Z-axial widthdifferent from each other or equal to each other, but the embodiment isnot limited thereto.

As shown in FIG. 7, a concave-convex structure, an unevenness structure,or a step difference structure may be formed on the upper portion of thesecond body 151. The second body 151 has a first protrusion 153protruding at the inner part of the upper portion of the second body151, a second protrusion 155 disposed at the outer part of the upperportion of the second body 151, and a third groove 154 formed betweenthe first and second protrusions 153 and 155. The first and secondprotrusions 153 and 155 may protrude at different heights, and the thirdgroove 154 may be formed at a depth lower than the top surface of thefirst protrusion 153. The coupling strength between the second body 151and the optical lens 181 may be increased by the first protrusion 153,the second protrusion 155, and the third groove 154 formed at the upperportion of the second body 151 as shown in FIG. 2.

As shown in FIG. 2, one or a plurality of light emitting chips 161 maybe disposed in the first opening 150. The light emitting chip 161 may bedisposed at least one of the first and second lead frames 121 and 132exposed through the bottom surface of the first opening 150 of the firstbody 141.

The light emitting chip 161 may be bonded onto the first lead frame 121through an adhesive member, connected with the first lead frame 121through the first wire 165, and connected with the second lead frame 131through the second wire 166. The adhesive member may include aninsulating material or a conductive material.

Alternatively, the light emitting chip 161 may be bonded to the firstlead frame 121 through a conductive adhesive member, and connected withthe second lead frame 131 through a wire. The light emitting chip 161may be bonded to the first and second lead frames 121 and 131 through aflip scheme. The light emitting chip 161 is driven by receiving powerfrom the first and second lead frames 121 and 131.

The light emitting chip 161 may have a chip structure includinghorizontally arranged electrodes as shown in FIG. 16 or may have a chipstructure including vertically arranged electrodes as shown in FIG. 17,but the embodiment is not limited thereto.

The light emitting chip 161 may include an LED chip including asemiconductor compound, for example, may include at least one of a UV(Ultraviolet) LED chip, a blue LED chip, a green LED chip, a white LEDchip, and a red LED chip. The light emitting chip 161 may include atleast one of group II-VI compound semiconductors and group III-Vcompound semiconductors. An active layer of the light emitting chip 161may have at least one of a dual bonding structure, a single wellstructure, a multi-well structure, a single quantum well structure, amulti-quantum well structure, a quantum wire structure, and a quantumdot structure. The active layer may be formed by alternately arrangingwell/barrier layers. For example, the well/barrier layers may be formedat two to 30 cycles of the stack structure of InGaN/GaN, GaN/AlGaN,InGaN/AlGaN, InGaN/InGaN, or InAlGaN/InAlGaN. In addition, the activelayer may include semiconductors such as ZnS, ZnSe, SiC, GaP, GaAlAs,MN, InN, and AlInGaP, but the embodiment is not limited thereto. Thelight emission wavelength of the active layer may be emitted as oneselected from an ultraviolet band light to a visible band light, but theembodiment is not limited thereto.

Referring to FIGS. 1, 3, and 4, a second opening 150A is spaced apartfrom the first opening 150. The second opening 150A is a region to openthe first and second bodies 141 and 151. The second open 150A is aregion to expose the first and second lead frames 121 and 131, and maybe defined as the second region. A protective device 163 may be disposedon at least one of the first and second lead frames 121 and 131 exposedto the second opening 150A. The protective device 163 may be bonded byusing a conductive adhesive agent, but the embodiment is not limitedthereto. The protective device 163 may be mounted on the first leadframe 121, and may be connected to the second lead frame 131 through athird wire 168.

The first and second bodies 141 and 151 serve as a partition between thefirst and second openings 150 and 150A. The thickness of the first body141 disposed between the first and second openings 150 and 150A may beequal to, less than, or greater than the thickness of the protectivedevice 163. When the thickness of the first body 141 may be thicker thanthe thickness of the protective device 163, light loss can be reduced.The circumference of the second opening 150A may be perpendicular orinclined with respect to the top surfaces of the first and second leadframes 121 and 131. Although the protective device 163 is disposed inthe second opening 150A, the protective device 163 may be disposed inanother region, or may be removed. In addition, the embodiment is notlimited thereto.

The resin layer 171 is formed in the first opening 150 of the secondbody 151. The resin layer 171 may include a transmissive resin materialsuch as silicon or epoxy. The resin layer 171 may include a materialrepresenting at least 70% of the transmittance, for example, at least90% of the transmittance with respect to the wavelength emitted from thelight emitting chip. The wavelength may be a blue peak wavelength, a UVwavelength, a red peak wavelength or a green peak wavelength.

The top surface of the resin layer 171 may be higher than a top surfaceof the light emitting chip 161. The top surface of the resin layer 171may be higher than the high points of the wires 165 and 166. Thecircumference of the top surface of the resin layer 171 may be equal toor different from the top surface of the second body 151, but theembodiment is not limited thereto.

The top surface of the resin layer 171 may include at least one of aflat surface, a concave surface, a convex surface, and a rough surface,but the embodiment is not limited thereto.

The refractive index of the resin layer 171 is 1.6 or less, and therefractive index of the second body 151 may be equal to or lower thanthat of the resin layer 171. In addition, the difference in therefractive index between the second body 151 and the resin layer 171 maybe ±0.2. For example, the refractive index of the second body 151 may bein the range of about 1.4 to 1.8, but the embodiment is not limitedthereto.

The resin layer 171 may include at least one selected from the group ofa filler, a dispersing agent, pigments, a phosphor, and a reflectivematerial. The phosphor mixed in the resin layer 171 absorbs lightemitted from the light emitting chip 161 and converts the wavelength ofthe light into light having a different wavelength. The phosphor mayinclude at least one of a yellow phosphor, a green phosphor, a bluephosphor and a red phosphor. For instance, the phosphor may include atleast one selected from the group consisting of a nitride basedphosphor, an oxy-nitride based phosphor and a sialon based phosphor,which are mainly activated by lanthanoid based elements, such as Eu orCe; an alkali earth halogen apatite phosphor, which is mainly activatedby a lanthanoid based element, such as Eu, or a transient metallicelement, such as Mn; an alkali earth metal boric acid halogen phosphor;an alkali earth metal aluminate phosphor; an alkali earth silicate; analkali earth sulfide; an alkali earth thio-gallate; an alkali earthsilicon nitride; a germinate; a rare-earth aluminate mainly activated bya lanthanoid based element, such as Ce; a rare-earth silicate; and anorganic chelating agent mainly activated by a lanthanoid based element,such as Eu, but the embodiment is not limited thereto.

The resin layer 171 may be formed with a width to cover the surface ofthe light emitting chip 161 and may make contact with the top surfaceand the lateral side of the light emitting chip 161. Alternatively, aphosphor layer may be formed between the light emitting chip 161 and theresin layer 171, and may be formed only on the top surface of the lightemitting chip 161.

As shown in FIG. 2, the optical lens 181 is disposed on the resin layer171. The optical lens 181 may include a transmissive resin material suchas silicon or epoxy, or a glass material. The refractive index of theoptical lens 181 may be equal to or lower than that of the resin layer171. The optical lens 181 may be disposed on the upper portion of theresin layer 171 and the second body 151. An adhesive layer may be formedon at least one of the top surface of the first body 141, the bottomsurface of the second body 151, and the top surface of the second body151 for the bonding purpose.

A portion of the light exit surface 182 of the optical lens 181 may beformed outward beyond the outer surface S5 of the second body 151, andmake contact with the top surface of the first body 141. A portion ofthe light exit surface 182 of the optical lens 181 may cover thecircumference of the second body 151 to densely make contact with theouter surface S5 of the second body 151, and may adjust the orientationangle of the second light L2 reflected by the first body 141 or thefirst light L1 passing through the second body 151 as shown in FIG. 2.

The circumference of the optical lens 181 may have a circular shape forthe purpose of light distribution, and may have a circular shape or anoval shape when viewed from the top.

A concave part 185 may be formed at the central portion of the topsurface of the optical lens 181. The concave part 185 is formedcorresponding to the light emitting chip 161, and formed downward fromthe top surface of the optical lens 181 toward the light emitting chip161. The concave part 185 of the optical lens 181 includes a totalreflection surface in which the light reflected from the top surface ofthe first body 141 can be refracted toward another direction and thelight exit surface 182 transmitting a portion of light. The totalreflection surface is formed by the concave part 185, and the light exitsurface 182 is disposed around the total reflection surface to refractthe light reflected from the total reflection surface. The concave part185 may have a circular shape when viewed from the top. The crosssectional surface of the concave part 185 may have a hemispherical shapeor a conical shape. A reflective member may be filled in the concavepart 185. The reflective member is formed at a preset depth in theconcave part 185 to reflect the light passing through the surface of theconcave part 185. The reflective member may include resin materialhaving metallic oxide, and at least 3 wt % of the metallic oxide may beadded in the resin material. The reflective member may include amaterial having a refractive index higher than that of the optical lens181.

Referring to FIGS. 3 and 4, a portion 183 of the optical lens 181 isfilled in the second opening 150A, or a portion of the resin layer maybe formed in the second opening 150A, but the embodiment is not limitedthereto.

The concave part 185 may not be formed in the central portion of the topsurface of the optical lens 181. The optical lens 181 may have ahemispherical shape or may have a concave-convex pattern.

A plurality of support bosses may be formed at the circumference of thelower portion of the optical lens 181. The support bosses are coupledwith the substrate or the cover to fix the optical lens 181. Inaddition, the optical lens 181 may be coupled with the upper portion ofthe second body 147 of the light emitting device afterpreviously-injection molding, but the embodiment is not limited thereto.

Referring to FIGS. 1 and 2, the light emitted from the light emittingchip 161 of the light emitting device 100 is emitted in a lateraldirection or in an upward direction. In this case, the portion of lightpassing through the resin layer 171 passes through the second body 151,and the remaining portions of the light are incident into the opticallens 181 through the top surface of the resin layer 171. In addition, aportion of the light incident into the optical lens 181 is reflected bythe total reflection surface of the concave part 185, and the reflectedlight may be reflected by the top surface of the second body 151. Inaddition, a portion of the light passing through the second body 151 maybe reflected by the top surface of the first body 141. Accordingly, thelight emitting device 100 may emit light in a substantially horizontaldirection by the first body 141 lower than the top surface of the lightemitting chip 161, so that the main beam may be emitted at anorientation angle of at least 135° as shown in FIG. 15. In addition, asshown in FIG. 8, as an angle θ1 is increased, the light orientationangle is more increased. As the angle θ1 is reduced, the lightorientation angle is more reduced. Accordingly, the light orientationangle θ1 can be adjusted according to the inclination surface or thethickness of the first body 141.

[Method of Manufacturing Light Emitting Device of First Embodiment]

As shown in FIGS. 5 and 6, the first body 141 having the open region150-1 is injection-molded on the lead frames 121 and 131 through amolding scheme by using a resin material representing higher reflectancethan transmittance. After the first body 141 has been formed as shown inFIG. 7, the transmissive second body 151 is injection-molded through atransfer scheme or an injection scheme by using the resin materialrepresenting higher transmittance than reflectance. The first and secondopenings 150 and 151 are formed in the second body 151. In addition, asshown in FIGS. 2 and 3, the light emitting chip 161 is mounted on thelead frames 121 and 131 exposed through the first opening 150 of thesecond body 151, and the protective device 163 is mounted on the leadframes 121 and 131 exposed through the second opening 150A. In addition,the light emitting chip 161 and the protective device 163 areelectrically connected to the lead frames 121 and 131 through the wires165, 166, and 168. In addition, the resin layer 171 is formed in thefirst opening 150 of the second body 151 through a dispensing scheme ora molding scheme, and a phosphor may be added in the resin layer 171.The optical lens 181 is coupled with the upper portion of the resinlayer 171. The optical lens 181 may be injection-molded through atransfer molding scheme, or an optical lens 181, which has beenpreviously prepared, may be bonded through the bonding scheme. Anotherresin layer may be further interposed between the resin layer 171 andthe optical lens 181, but the embodiment is not limited thereto. Anadhesive layer may be formed on the top surfaces of the first body 141and the second body 151, but the embodiment is not limited thereto.

Second Embodiment

FIG. 9 is a view showing a light emitting device according to the secondembodiment. In the following description of the second embodiment, thesame parts as those of the first embodiment will make a reference to thefirst embodiment.

Referring to FIG. 9, the light emitting device includes the lead frames121 and 131, the first body 141, the second body 151, a first resinlayer 172, a second resin layer 173, and an optical lens 181.

The first resin layer 172 is formed in the first opening 150corresponding to the resin layer of FIG. 2. The first resin layer 172may include transmissive resin material, and may have a phosphortherein.

The second resin layer 173 is disposed between the first resin layer 172and the optical lens 181. A portion of the second resin layer 173 may bedisposed between the second body 151 and the optical lens 181. Thesecond resin layer 173 may include a transmissive resin material such assilicon or epoxy. The second resin layer 173 may have impurities such asa phosphor therein or may not have impurities such as the phosphortherein.

The top surface of the second resin layer 173 may have a height equal toor higher than that of the top surface of the second body 151. Theoptical lens 181 may be disposed on the outer portions of the secondresin layer 173 and the second body 151. A portion of the light exitsurface 182 of the optical lens 181 may make contact with the outerportion of the second body 151 and may make contact with the top surfaceof the outer portion of the first body 141. Accordingly, the couplingstrength of the optical lens 181 may be increased.

At least one of the first and second resin layers 172 and 173 mayinclude at least one of a filler, a dispersing agent, figments, aphosphor, and a reflective material. A phosphor is contained in thefirst resin layer 1 72, and the second resin layer 173 may not containan impurities such as the phosphor. In addition, the first and secondresin layers 172 and 173 may include phosphors emitting the samewavelength or different wavelengths, but the embodiment is not limitedthereto.

The first adhesive layer 191 is interposed between the first body 141and the second body 151 and bonds the first body 141 and the second body151 including different resin materials to each other. The secondadhesive layer 192 may be interposed between the second body 151 and thesecond resin layer 173, and may be bonded between the second body 151and the second resin layer 173. The second resin layer 173 is disposedon the top surface thereof with a third adhesive layer 193, and thethird adhesive layer 193 may improve the adhesive strength with theoptical lens 181.

The first to third adhesive layers 191, 192, and 193 may include resinmaterial such as silicon or epoxy in order to improve the adhesivestrength, and may have the thickness of 1 μm to 10 μm.

The first adhesive layer 191 may include reflective metal or ascattering agent in order to improve the reflectance, and the second andthird adhesive layers 192 and 193 may include a dispersing agent or aphosphor, but the embodiment is not limited t hereto.

Third Embodiment

FIG. 10 is a view showing a light emitting device according to the thirdembodiment. Hereinafter, in the following description of the thirdembodiment, the same parts as those of the first embodiment will make areference to the first embodiment.

Referring to FIG. 10, in the light emitting device, the first opening150 is formed in the second body 151, and a resin layer such as aphosphor layer 175 is disposed in the first opening 150. The surface ofthe phosphor layer 175 may be formed on the circumference of the lightemitting chip 161 within the uniform distance from the center of thelight emitting chip 161. The phosphor layer 175 has a hemisphericalshape so that the distribution of lights having the wavelength convertedby the phosphor can be uniformly adjusted. The top surface of thephosphor layer 175 may more protrude from the top surface of the secondbody 151, and the bottom surface of the phosphor layer 175 may have awidth wider than that of the light emitting chip 161. The width of thelower portion of the phosphor layer 175 may be narrower than theinterval between the first wire 165 and the second wire 166, but theembodiment is not limited thereto.

The peripheral portion of the phosphor layer 175 in the first opening150 of the second body 151 may be filled with a portion 184 of theoptical lens 181, may include a resin material, or may be disposed inthe form of a space. The material filled in the first opening 150 maymake contact with the phosphor layer 175. When the second body 151representing higher transmittance is disposed around the light emittingchip 161, so that the first light is emitted from the light emittingchip 161, and the second light having the wavelength converted by thephosphor layer 175 is emitted, the first and second lights may beemitted at a light orientation angle of at least 130°.

Fourth Embodiment

FIG. 11 is a view showing a light emitting device according to thefourth embodiment. Hereinafter, in the following description of thefourth embodiment, the same parts as those of the first embodiment willmake a reference to the first embodiment.

Referring to FIG. 11, the light emitting device is an example formed bymodifying an upper portion 154A of the second body 151 representinghigher transmittance. The upper portion 154A of the second body 151 mayhave a step difference structure. The upper portion 154A of the secondbody 151 has a thickness gradually thinner from an inner part adjacentto the light emitting chip 161 to an outer portion thereof. The upperportion 154A of the second body 151 has the step difference structure,so that the contact area with the optical lens 181 is increased.Accordingly, the adhesive strength can be improved.

In addition, the second body 151 may have a thinner thickness at theinner part thereof and a thicker thickness at the outer part thereof sothat the second body 151 supports the optical lens 181 and the firstbody 141, and the light emitted from the light emitting chip 161 istransmitted.

Fifth Embodiment

FIG. 12 is a view showing a light emitting device according to the fifthembodiment. Hereinafter, in the following description of the fifthembodiment, the same parts as those of the first embodiment will make areference to the first embodiment.

Referring to FIG. 12, in the light emitting device, first to fourthconcave-convex structures P1, P2, P3, and P4 may be formed in the firstand second lead frames 121 and 131. The first and second concave-convexstructures P1 and P2 have preset patterns, and may be formed at a stepdifference region of the first lead frame 121 exposed to the first hole122 of the first lead frame 121 and at a step difference region of thesecond lead frame 131 exposed to the second hole 132 of the second leadframe 131. The first and second concave-convex structures P1 and P2 mayincrease the contact area with the first coupling part 143 of the firstbody 141 and the second coupling part 144 of the first body 141.Accordingly, moisture can be prevented from being infiltrated betweenthe first body 141 and the holes 122 and 132 of the lead frames 121 and131. The concave-convex structure P1 and P2 may include at least one ofa lattice shape, a stripe shape, and a mesh shape.

In addition, the third and fourth concave-convex structures P3 and P4are formed with preset patterns on the bottom surfaces of the first endportion 124 of the first lead frame 121 and the second end portion 134of the second lead frame 131, so that the third and fourthconcave-convex structures P3 and P4 may increase the adhesion area withthe gap part 142 of the first body 141. The moisture can be preventedfrom being infiltrated through the gap part 142 between the first body141 and the lead frames 121 and 131.

Alternatively, fine concave-convex structures are additionally formed onthe top surface of the first and second lead frames 121 and 131, therebyenhancing the adhesion with the first body 141, so that moisture can beprevented from being infiltrated.

The fifth concave-convex structure P5 having a preset shape is formed onthe top surface of the first body 141, and increases the adhesion areabetween the second body 151 and the light exit surface 182 of theoptical lens 181, and moisture can be prevented from being infiltrated.

The upper portion 154B of the second body 151 may have a step differencestructure gradually lowered from an outer portion thereof to an innerportion thereof. The resin layer 174 may be formed from the upperportion 154B of the second body 151 to the inner portion of the secondbody 151, but the embodiment is not limited thereto.

The resin layer 174 may include a transmissive resin material, and mayhave a phosphor therein. Alternatively, a phosphor layer may be bondedto a region between the resin layer 174 and the light emitting chip 161,that is, on the top surface of the light emitting chip 161.

Sixth Embodiment

FIG. 13 is a view showing a light emitting device according to a sixthembodiment. Hereinafter, in the following description of the sixthembodiment, the same parts as those of the first embodiment will make areference to the first embodiment.

Referring to FIG. 13, the light emitting device includes a first leadframe 221, a second lead frame 231, a first body 241, a second body 251,a resin layer 271, and an optical lens 281.

The first lead frame 221 includes a heat radiation part 222 having acavity 225, a first connection part 223, and a first lead part 224. Thecavity 225 has a concave inner part formed due to the bending of theheat radiation part 222. The first connection part 223 is bent from theheat radiation part 22, and exposed on the first opening 250 of thesecond body 251.

The first lead part 224 is bent from the first connection part 223 andextends to the bottom surface of the first body 241 through the firstbody 241. The first lead part 224 may protrude outward beyond the secondlateral side S12 of the first body 241.

The first lead frame 221 may include at least one of grooves and holesfor the coupling purpose with the first body 241, but the embodiment isnot limited thereto. A light emitting chip 261 is disposed on the bottomsurface of the cavity 225 of the heat radiation part 222. The lateralside of the cavity 225 is perpendicular to the bottom surface of thefirst body 241 or is inclined at an angle of at least 90° with respectto the bottom surface of the first body 241, thereby reflecting light ofthe light emitting chip 261. The heat radiation part 222 may radiateheat emitted from the light emitting chip 261 through a substrate or aheat radiation plate.

The second lead frame 2431 includes a second connection part 233 and asecond lead part 234. The second connection part 233 is exposed to thefirst opening 250 of the second body 251, and the second lead part 234extends from the second connection part 233 to the bottom surface of thefirst body 241 through the first body 241. The second lead part 234 mayprotrude outward beyond the first lateral side S11 of the first body241.

The first connection part 223 of the first lead frame 221 and the secondconnection part 233 of the second lead frame 231 are exposed in thefirst opening 250 of the second body 251, and the second body 251 isdisposed at the central portion thereof with the cavity 225.

The first connection part 223 of the first lead frame 221 and the secondconnection part 233 of the second lead frame 231 are exposed to theupper portion of the first body 241. The light emitting chip 261 may beconnected to the first connection part 223 through the first wire 266,and may be connected to the second connection part 233 through thesecond wire 267.

The first body 241 may include a material representing reflectancehigher than transmittance. The first body 241 is disposed under thefirst lead frame 221 and the second lead frame 231, and a portion of thefirst body 241 may be formed at the gap 235 between the first and secondlead frames 221 and 231. In addition, an outer portion of the first body241 may be formed on the top surfaces of the first and second leadframes 221 and 231.

The outer portion of the top surface 244 of the first body 241 isinclined, and an angle between an outer portion of the top surface 244adjacent to the first lateral side S11 and an outer portion of the topsurface 244 adjacent to the second lateral side S12 may be in the rangeof 140° to 170°.

The second body 251 representing high transmittance is disposed aroundthe top surface of the first body 241. The second body 251 transmits theincident light to widen the light orientation angle. The inner lateralside 252 of the second body 251 may be inclined, but the embodiment isnot limited thereto.

The resin layer 271 is formed in the cavity 225. The resin layer 271 mayinclude a resin material such as silicon or epoxy. The resin layer 271may include at least one of a filler, a dispersing agent, figments, aphosphor, and a reflective material.

The upper portion 253 of the second body 251 has a step differencestructure, and the lower portion of the light exit surface 282 of theoptical lens 281 may be coupled to the step difference structure. Theoptical lens 281 is disposed at the central portion thereof with aconcave part 285. The bottom surface of the optical lens 281 may makecontact with the top surface of the resin layer 271, or may be spacedapart from the resin layer 271. Another resin layer may be furtherdisposed between the optical lens 281 and the resin layer 271, but theembodiment is not limited thereto.

The second body 251 is disposed in the first opening 250 thereof withwires 266 and 267 or a different resin layer. The outer surface S15 ofthe second body 251 may be vertically aligned in line with the first andsecond lateral sides S11 and S12 of the first body 241, but theembodiment is not limited thereto.

Seventh Embodiment

FIG. 14 is a view showing a light emitting device according to a seventhembodiment. Hereinafter, in the following description of the seventhembodiment, the same parts as those of the first embodiment will make areference to the first embodiment.

Referring to FIG. 14, the light emitting device includes a first leadframe 321, a second lead frame 331, a third lead frame 325 between thefirst and second lead frames 321 and 331, a resin layer 371 on the thirdlead frame 325, a first body 341 representing reflectance and supportingthe first to third lead frames 321, 331, and 325, a second body 351representing transmittance on the first body 341, and an optical lens381 on the resin layer 371.

The first lead frame 321 is interposed between a first lateral side S11of the first body 341 and the third lead frame 325, and includes a firstconnection part 322 and a first lead part 323. The first connection part322 is exposed to the top surface of the first body 341, and connectedwith the light emitting chip 361 through a first wire 366. The firstlead part 323 is bent or extends from the first connection part 322 inthe first body 341 so that the first lead part 323 is disposed on thebottom surface of the first body 341. The first lead part 323 mayprotrude toward the first lateral side S11 of the first body 341.

The second lead frame 331 is interposed between the second lateral sideS12 of the first body 341 and the third lead frame 325, and includes asecond connection part 332 and a second lead part 333. The secondconnection part 332 is exposed to the top surface of the first body 341,and connected to the light emitting chip 361 through the second wire367. The second lead part 333 is bent in the first body 341, and extendsto the bottom surface of the first body 341 while protruding the secondlateral side S12 of the first body 341.

The third lead frame 325 includes a heat radiation part 326 having acavity 320 and a support part 327 bent from the heat radiation part 326.The light emitting chip 361 is disposed on the bottom surface of thecavity 329, and the bottom surface of the heat radiation part 326 may beexposed to the bottom surface of the first body 341. The support part327 may be exposed to the top surface of the first body 341, but theembodiment is not limited thereto. The heat radiation part 326 mayradiate heat generated from the light emitting chip 361 through thesubstrate disposed at the lower portion or a heat radiation plate.

The first body 341 includes a first gap part 342 interposed between thefirst and third lead frames 321 and 325 and a second gap part 343interposed between the third and second lead frames 325 and 331.

The first connection part 322 of the first lead frame 321 and the secondconnection part 332 of the second lead frame 331 are exposed in thefirst opening 350 of the second body 351, and the cavity 320 is disposedat the central portion of the second body 351.

The light emitting chip 361 is disposed on the bottom surface of thecavity 320. The light emitting chip 361 is connected to the firstconnection part 322 of the first lead frame 321 through the first wire366, and connected to the second connection part 332 of the second leadframe 331 through the second wire 367.

A transmissive support layer 371 is formed in the cavity 320. Thetransmissive support layer 371 may be aligned in line with the topsurface of the first body 341, but the embodiment is not limitedthereto. The resin layer 371 may include a resin material such assilicon or epoxy. The resin layer 371 may include at least one of afiller, a dispersing agent, pigments, phosphors, and a reflectivematerial

The first body 341 corresponds to the first body of the firstembodiment. The top surface 344 of the outer portion of the first body341 may be inclined, and an interior angle about the inclined surface ofthe first body 341 may be in the range of at least 135° to less than180°.

The second body 351 may correspond to the second body of the firstembodiment, and the first opening 350 formed inside the second body 351may have a width wider than the width of the top surface of the cavity320, but the embodiment is not limited thereto.

The top surface of the light emitting chip 361 may be lower than the topsurface of the first body 341, but the embodiment is not limitedthereto. The light emitted from the light emitting chip 361 may bereflected by a concave part 385 of the optical lens 381, and thereflected light may be reflected by the top surface and the inclinedsurface of the first body 341. The light incident into the second body351 is transmitted to wide the light orientation angle.

The light exit surface of the optical lens 381 may be disposed inwardbeyond a lateral side S15 of the second body 351, but the embodiment isnot limited thereto.

Alternatively, the top surface of the light emitting chip 361 may beexposed to the top surface of the first body 341. In this case, thelight emitted from the light emitting chip 361 is reflected by the topsurface and the inclined surface of the first body 341, or passesthrough the second body 351. Accordingly, the light orientation anglecan be widened. In this case, the depth of the cavity 320 may be variedaccording to the bending of the heat radiation part 326 of the thirdlead frame 325, and the depth of the cavity 329 may be adjusted.

The light emitting device chip according to the embodiment will bedescribed referring to example of FIGS. 16 and 17.

FIG. 16 is a side sectional view showing one example of the lightemitting chip according to the embodiment.

Referring to FIG. 16, the light emitting chip includes a substrate 411,a buffer layer 412, a light emitting structure 410, a first electrode416, and a second electrode 417. The substrate 411 may include asubstrate including a transmissive material or a non-transmissivematerial, and may include a conductive substrate or an insulatingsubstrate.

The buffer layer 412 reduces the lattice constant difference between thematerials constituting the substrate 411 and the light emittingstructure 410, and may include a nitride semiconductor. A nitridesemiconductor layer, which is not doped with dopants, is furtherdisposed between the buffer layer 412 and the light emitting structure410, so that the crystal quality can be improved.

The light emitting structure 410 includes a first conductivesemiconductor layer 413, an active layer 414, and a second conductivesemiconductor layer 415.

The first conductive semiconductor layer 413 may include the group III-Vcompound semiconductor doped with the first conductive dopant. Forexample, the first conductive semiconductor layer 413 may include thesemiconductor material having the compositional formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). In detail, the firstconductive semiconductor layer 413 may include the stack structure oflayers including one selected from the group consisting of GaN, InN,AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, andAlGaInP. If the first conductive semiconductor layer 413 is an n typesemiconductor layer, the first conductive dopant includes the n typedopant such as Si, Ge, Sn, Se, or Te.

A first clad layer may be formed between the first conductivesemiconductor layer 413 and the active layer 414. The first clad layermay include a GaN-based semiconductor, and the bandgap of the first cladlayer may be equal to or greater than the bandgap of the active layer414. The first clad layer has the first conductive type, and confinescarriers.

The active layer 414 is disposed on the first conductive semiconductorlayer 413, and includes a single quantum well structure, a multiplequantum well (MQW) structure, a quantum wire structure or a quantum dotstructure. The active layer 414 has the cycle of the well and barrierlayers. The well layer may have the composition formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1), and the barrier layermay have the composition formula of In_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1,0≦y≦1, 0≦x+y≦1). At least one cycle of the well/barrier layers may beused through the stack structure of InGaN/GaN, GaN/AlGaN, InGaN/AlGaN,InGaN/InGaN, and InAlGaN/InAlGaN. The barrier layer may include asemiconductor material having the bandgap higher than the bandgap of thewell layer.

The second semiconductor conductive layer 415 is formed on the activelayer 414. The second semiconductor conductive layer 415 includes asemiconductor doped with second conductive dopants, for example,includes a semiconductor having the composition formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1). In detail, the secondconductive semiconductor layer 415 may include one selected fromcompound semiconductors such as GaN, InN, MN, InGaN, AlGaN, InAlGaN,AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. If the second conductivesemiconductor layer 415 is a p type semiconductor layer, thesemiconductor conductive dopant includes the p type dopant such as Mg,Zn, Ca, Sr, or Ba.

The second conductive semiconductor layer 415 may include a superlatticestructure, and the superlattice structure may include an InGaN/GaNsuperlattice structure or am AlGaN/GaN superlattice structure. Thesuperlattice structure of the second conductive semiconductor layer 415abnormally spreads the current, thereby protecting the active layer 414.

In addition, the light emitting structure 410 may have an oppositeconductive type. For example, the first conductive semiconductor layer413 may include a p type semiconductor layer, and the second conductivesemiconductor layer 415 may include an n type semiconductor layer. Thesecond conductive semiconductor layer 415 may be disposed thereon with afirst conductive semiconductor layer having the polarity opposite to thesecond conductive type polarity.

The light emitting structure 410 may be realized by using one of an n-pjunction structure, a p-n junction structure, an n-p-n junctionstructure, and a p-n-p junction structure. The “p” represents a p typesemiconductor, the “n” represents an n type semiconductor layer, and the“-” represents that the p type semiconductor is directly or indirectlyconnected to the n type semiconductor. Hereinafter, a case that theuppermost layer of the light emitting structure 410 is the secondconductive semiconductor layer 415 will be described for the convenienceof explanation.

The first electrode 416 is disposed on the first conductivesemiconductor layer 413, and the second electrode 417 having a currentspreading layer is disposed on the second conductive semiconductor layer415. The first and second electrodes 416 and 417 are connected to eachother through a wire, or through another connection scheme.

FIG. 17 is a graph showing another example of the light emitting chipaccording to the embodiment. Hereinafter, in the following descriptionof the embodiment, the details of the same parts as that of FIG. 16 willbe omitted except for brief description.

Referring to FIG. 17, in a light emitting chip according to theembodiment, a contact layer 421 is formed under a light emittingstructure 410, a reflective layer 424 is formed under the contact layer421, a support member 425 is formed under the reflective layer 424, anda protective layer 423 may be formed around the reflective layer 424 andthe light emitting structure 410.

One or a plurality of first electrodes 416 may be formed on the lightemitting structure 410, and the first electrode 416 includes a padbonded to a wire.

The light emitting chip may be formed by removing a growth substrateafter forming a contact layer 421, a protective layer 423, a reflectivelayer 424, and a support member 423 under the second conductivesemiconductor layer 415.

The contact layer 421 may make ohmic-contact with a lower layer of thelight emitting structure 410, for example, the second conductivesemiconductor layer 415, and may include a metallic oxide, a metallicnitride, an insulating material, or a conductive material. For example,the contact layer 421 may include ITO (indium tin oxide), IZO (indiumzinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zincoxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tinoxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO(gallium zinc oxide), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf,and the selective combination thereof. The contact layer 421 may beformed in a multi-layer structure by using a metallic material and atransparent material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, or ATO.For example, the contact layer 421 may have the stack structure ofIZO/Ni, AZO/Ag, IZO/Ag/Ni, or AZO/Ag/Ni. A layer to block current may befurther formed in the contact layer 421 corresponding to the electrode416.

The protective layer 423 may include a metallic oxide or an insulatingmaterial. For example, the protective layer 423 may selectively includeITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tinoxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zincoxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO(antimony tin oxide), GZO (gallium zinc oxide), SiO₂, SiO_(x),SiO_(x)N_(y), Si₃N₄, Al₂O₃, or TiO₂. The protective layer 423 may beformed through a sputtering scheme or a deposition scheme. The metalconstituting the reflective layer 424 may prevent the layers of thelight emitting structure 410 from being shorted.

The reflective layer 424 may include metal such as Ag, Ni, Al, Rh, Pd,Ir, Ru, Mg, Zn, Pt, Au, Hf, or the selective combination thereof. Thereflective layer 424 may have a width greater than the width of thelight emitting structure 410, thereby improving the light reflectionefficiency. A metallic layer for bonding and a metallic layer forthermal diffusion may be further disposed between the reflective layer424 and the support member 425, but the embodiment is not limitedthereto.

The support member 425 serves as a base substrate, and may include metalsuch as Cu, Au, Ni, Mo, or Cu—W, and a carrier wafer, such as Si, Ge,GaAs, ZnO, and SiC. An adhesive layer may be further formed between thesupport member 425 and the reflective layer 424, and bonds the twolayers to each other. The disclosed light emitting chip is four theillustrative purpose, and the embodiment is not limited thereto. Thelight emitting chip may be selective applied to the light emittingdevice according to the embodiment, but the embodiment is not limitedthereto.

<Lighting System>

The light emitting device according to the embodiment is applicable to alighting system. The lighting system includes a structure in which aplurality of light emitting devices are arrayed. The lighting systemincludes a display apparatus shown in FIGS. 18 and 19, a lightingapparatus shown in FIGS. 20 and 21, a lighting lamp, a signal lamp, aheadlamp for a vehicle, and an electronic display.

FIG. 18 is an exploded perspective view showing a display apparatushaving the light emitting device according to the embodiment.

Referring to FIG. 18, a display apparatus 1000 according to theembodiment includes a light guide plate 1041, a light emitting module1031 to supply light to the light guide plate 1041, a reflective member1022 under the light guide plate 1041, an optical sheet 1051 on thelight guide plate 1041, a display panel 1061 on the optical sheet 1051,and a bottom cover 1011 to receive the light guide plate 1041, the lightemitting module 1031, and the reflective member 1022, but the embodimentis not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate1041, the optical sheet 1051, and the light unit 1050 may be defined asa light unit 1050.

The light guide plate 1041 diffuses the light supplied from the lightemitting module 1031 to provide surface light. The light guide plate1041 may include a transparent material. For example, the light guideplate 1041 may include one of acryl-based resin, such as PMMA (polymethyl methacrylate, PET (polyethylene terephthalate), PC(polycarbonate), COC (cyclic olefin copolymer) and PEN (polyethylenenaphtha late) resin.

The light emitting module 1031 is disposed on at least one side of thelight guide plate 1041 to supply the light to at least one side of thelight guide plate 1041. The light emitting module 1031 serves as thelight source of the display device.

At least one light emitting module 1031 is disposed to directly orindirectly supply the light from one side of the light guide plate 1041.The light emitting module 1031 may include a board 1033 and the lightemitting device according to the embodiments or the light emittingdevice 100. The light emitting device or the light emitting device 100are arranged on the board 1033 while being spaced apart from each otherat the predetermined interval.

The board 1033 may include a printed circuit board (PCB) including acircuit pattern (not shown). In addition, the board 1033 may alsoinclude a metal core PCB (MCPCB) or a flexible PCB (FPCB) as well as atypical PCB, but the embodiment is not limited thereto. If the lightemitting device 100 is installed on the side of the bottom cover 1011 oron a heat dissipation plate, the board 1033 may be omitted. The heatdissipation plate partially makes contact with the top surface of thebottom cover 1011.

In addition, the light emitting device 100 are arranged such that lightexit surfaces to discharge light of the light emitting device 100 arespaced apart from the light guide plate 1041 by a predetermined distanceon the board 1033, but the embodiment is not limited thereto. The lightemitting device 100 may directly or indirectly supply the light to alight incident surface, which is one side of the light guide plate 1041,but the embodiment is not limited thereto.

The reflective member 1022 is disposed below the light guide plate 1041.The reflective member 1022 reflects the light, which is traveleddownward through the bottom surface of the light guide plate 1041,toward the display panel 1061, thereby improving the brightness of thelight unit 1050. For example, the reflective member 1022 may includePET, PC or PVC resin, but the embodiment is not limited thereto. Thereflective member 1022 may serve as the top surface of the bottom cover1011, but the embodiment is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightemitting module 1031, and the reflective member 1022 therein. To thisend, the bottom cover 1011 has a receiving section 1012 having a boxshape with an opened top surface, but the embodiment is not limitedthereto. The bottom cover 1011 can be coupled with the top cover (notshown), but the embodiment is not limited thereto.

The bottom cover 1011 can be manufactured through a press process or anextrusion process by using metallic material or resin material. Inaddition, the bottom cover 1011 may include metal or non-metallicmaterial having superior thermal conductivity, but the embodiment is notlimited thereto.

The display panel 1061, for example, is an LCD panel including first andsecond transparent substrates, which are opposite to each other, and aliquid crystal layer interposed between the first and second substrates.A polarizing plate can be attached to at least one surface of thedisplay panel 1061, but the embodiment is not limited thereto. Thedisplay panel 1061 displays information by allowing the light to passtherethrough. The display device 1000 can be applied to various portableterminals, monitors of notebook computers, monitors or laptop computers,and televisions.

The optical sheet 1051 is disposed between the display panel 1061 andthe light guide plate 1041 and includes at least one transmissive sheet.For example, the optical sheet 1051 includes at least one selected fromthe group consisting of a diffusion sheet, a horizontal and verticalprism sheet, and a brightness enhanced sheet. The diffusion sheetdiffuses the incident light, the horizontal and vertical prism sheetconcentrates the incident light onto the display panel 1061, and thebrightness enhanced sheet improves the brightness by reusing the lostlight. In addition, a protective sheet can be disposed on the displaypanel 1061, but the embodiment is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 can be disposed inthe light path of the light emitting module 1031 as optical members, butthe embodiment is not limited thereto.

FIG. 19 is a sectional view showing a display apparatus according to theembodiment.

Referring to FIG. 19, the display device 1100 includes a bottom cover1152, a board 1120 on which the light emitting device 100 are arrayed,an optical member 1154, and a display panel 1155.

The board 1120 and the light emitting device 100 may constitute thelight emitting module 1160. In addition, the bottom cover 1152, at leastone light emitting module 1160, and the optical member 1154 mayconstitute the light unit. The bottom cover 1151 can be disposed with areceiving section 1153, but the embodiment is not limited thereto. Thelight emitting module 1160 includes a board 1120, and a plurality oflight emitting devices arranged on the board 1120 or a light emittingdevice 100.

The optical member 1154 may include at least one selected from the groupconsisting of a lens, a light guide plate, a diffusion sheet, ahorizontal and vertical prism sheet, and a brightness enhanced sheet.The light guide plate may include PC or PMMA (Poly methyl methacrylate).The light guide plate can be omitted. The diffusion sheet diffuses theincident light, the horizontal and vertical prism sheet concentrates theincident light onto a display region, and the brightness enhanced sheetimproves the brightness by reusing the lost light.

The optical member 1154 is disposed above the light emitting module 1160in order to convert the light emitted from the light emitting module1160 into the surface light.

FIG. 20 is a perspective view of a lighting unit according to anembodiment.

Referring to FIG. 20, the lighting unit 1500 may include a case 1510, alight emitting module 1530 including in the case 1510, and a connectionterminal 1520 including in the case 1510 and supplied with an electricpower from an external power supply.

The case 1510 may be preferably formed of a material having good heatshielding characteristics, for example, a metal material or a resinmaterial.

The light emitting module 1530 may include a board 1532, and at leastone light emitting device 100 according to the embodiments mounted onthe board 1532. The light emitting device 100 may include a plurality oflight emitting device packages which are arrayed apart by apredetermined distance from one another in a matrix configuration.

The board 1532 may be an insulator substrate on which a circuit patternis printed, and may include, for example, a printed circuit board (PCB),a metal core PCB, a flexible PCB, a ceramic PCB, an FR-4 substrate, etc.

Also, the board 1532 may be formed of a material to efficiently reflectlight, and a surface thereof may be formed in a color capable ofefficiently reflecting light, for example, white color, or silver color.

The at least one light emitting device 100 may be mounted on the board1532. Each of the light emitting devices 100 may include at least onelight emitting diode (LED) chip. The LED chip may include a color LEDemitting red, green, blue or white light, and a UV LED emittingultraviolet (UV).

The light emitting module 1530 may have a combination of various lightemitting devices so as to obtain desired color and luminance. Forexample, the light emitting module 1530 may have a combination of awhite LED, a red LED, and a green LED so as to obtain a high colorrendering index (CRI).

The connection terminal 1520 may be electrically connected to the lightemitting module 1530 to supply power. The connection terminal 1520 maybe screwed and coupled to an external power in a socket type, but thepresent disclosure is not limited thereto. For example, the connectionterminal 1520 may be made in a pin type and inserted into an externalpower, or may be connected to the external power through a power line.

FIG. 21 is an exploded perspective view showing another example of alighting unit having the light emitting device according to theembodiment.

Referring to FIG. 21, the lighting device according to the embodimentmay include a cover 2100, a light emitting module 2200, a heat radiationmember 2400, a power supply part 2600, an inner case 2700, and a socket2800. In addition, the light emitting device according to the embodimentmay further include at least one of a member 2300 and a holder 2500. Thelight emitting module 2200 may include the light emitting device or thelight emitting device package according to the embodiment.

For example, the cover 2100 has the shape of a bulb, or a hemisphericalshape. The cover 2100 may have a hollow structure, and a portion of thecover 2100 may be open. The cover 2100 may be optically connected to thelight emitting module 2200, and may be coupled with the heat radiationmember 2400. The cover 2100 may have a recess part coupled with the heatradiation member 2400.

The inner surface of the cover 2100 may be coated with ivory whitepigments serving as a diffusing agent. The light emitted from the lightemitting module 2200 may be scattered or diffused by using the ivorywhite material, so that the light can be discharged to the outside.

The cover 2100 may include glass, plastic, PP, PE, or PC. In this case,the PC represents superior light resistance, superior heat resistance,and superior strength. The cover 2100 may be transparent so that thelight emitting module 2200 may be recognized at the outside.

In addition, the cover 2100 may be opaque. The cover 2100 may be formedthrough a blow molding scheme.

The light emitting module 2200 may be disposed at one surface of theheat radiation member 2400. Accordingly, the heat emitted from the lightemitting module 2200 is conducted to the heat radiation member 2400. Thelight emitting module 2200 may include a light emitting device 2210, aconnection plate 2230, and a connector 2250.

The member 2300 is disposed on the top surface of the heat radiationmember 2400, and has a guide groove 2310 having a plurality of lightemitting devices 2210 and a connector 2250 inserted into the guidegroove 2310. The guide groove 2310 corresponds to the substrate of thelight emitting device 2210 and the connector 2250.

White pigments may be applied to or coated on the surface of the member2300. The member 2300 reflects light, which reflected by the innersurface of the cover 2100 to return to the light emitting module 2200,toward the cover 2100. Accordingly, the light efficiency of the lightingapparatus according to the embodiment can be improved.

The member 2300 may include an insulating material. The connection plate2230 of the light emitting module 2200 may include anelectric-conductive material. Accordingly, the heat radiation member2400 may be electrically connected to the connection plate 2230. Themember 2300 includes an insulating material to prevent the electricalshort between the connection plate 2230 and the heat radiation member2400. The heat radiation member 2400 receives heat from the lightemitting module 2200 and the heat from the power supply part 2600 andradiates the heats.

The holder 2500 blocks a receiving groove 2719 of an insulating part2710 disposed in an internal case 2700. Accordingly, the power supplypart 2600 received in the insulating part 2710 of the internal case 2700is sealed. The holder 2500 has a guide protrusion part 2510. The guideprotrusion part 2510 may include a hole allowing a protrusion part 2610of the power supply part 2600 to pass therethrough.

The power supply part 2600 processes and transforms an electrical signalreceived from the outside and supplies the electrical signal to thelight emitting module 2200. The power supply part 2600 is received inthe receiving groove 2719 of the internal case 2700, and sealed in theinternal case 2700 by the holder 2500.

The power supply part 2600 may include a protrusion part 2610, a guidepart 2630, a base 2650, and an extension part 2670.

The guide part 2630 protrudes outward from one side of the base 2650.The guide part 2630 may be inserted into the holder 2500. A plurality ofparts may be disposed on one surface of the base 250. For example, theparts include a DC converter, a driving chip to drive the light emittingmodule 220, and an ESD (electrostatic discharge) protective device toprotect the light emitting module 2200, but the embodiment is notlimited thereto.

The extension part 2670 protrudes outward from another side of the base2650. The extension part 2670 is inserted into the connection part 2750of the internal case 2700, and receives an electrical signal from theoutside. For example, the extension part 2670 may be equal to or lessthan the width of the connection part 2750 of the internal case 2700.The extension part 2670 may be electrically connected to the socket 2800through a wire.

The internal case 2700 may be disposed therein with a molding parttogether with the power supply part 2600. The molding part is formed byhardening a molding liquid, so that the power supply part 2600 may befixed into the internal case 2700.

As described above, according to the embodiment, the light orientationangle of the light emitting device can be widened. According to theembodiment, the strength of the bodies can be enhanced by stacking aplurality of bodies. According to the embodiment, the number of thelight emitting devices arranged in each light emitting module can bereduced. The embodiment can improve the reliability of the lightemitting device and a lighting unit having the same.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device comprising: a plurality of lead frames; a first body having a higher reflectance than transmittance, disposed on top surfaces of the lead frames and having an open region at a predetermined region of the top surfaces of the plurality of lead frames; a second body having a higher transmittance than reflectance, having a first opening corresponding to the open region of the first body, and disposed on a top surface of the first body; a light emitting chip on at least one of the plurality lead frames exposed in the first opening of the second body; and a first resin layer disposed in the first opening of the second body to cover the light emitting chip.
 2. The light emitting device of claim 1, wherein the top surface of the first body makes contact with a bottom surface of the second body, and has a height lower than a height of a top surface of the light emitting chip.
 3. The light emitting device of claim 2, wherein the first body includes an inner region adjacent to the light emitting chip and an outer region which is thicker than the inner region and extends from the inner region.
 4. The light emitting device of claim 3, wherein a top surface of the inner region of the first body is inclined at an angle of 65° to 89° about a perpendicular line to the light emitting chip.
 5. The light emitting device of claim 4, wherein a top surface of the outer region of the first body has a height lower than a height of the top surface of the light emitting chip.
 6. The light emitting device of claim 5, wherein a first lead frame of the plurality of lead frames is disposed under the light emitting chip, includes a first groove recessed at a peripheral portion of the light emitting chip and a plurality of holes disposed around the first groove, and wherein the first body is disposed in the first groove and the plurality of holes.
 7. The light emitting device of claim 1, wherein the plurality of lead frames include a second lead frame spaced apart from the first lead frame and electrically connected to the light emitting chip, wherein the second lead frame includes a second groove, which is disposed adjacent to the first opening and has a shape of a line having a width longer than a width of the first opening, and a plurality of second holes disposed outside the second groove, the first body is disposed in the second groove and the plurality of second holes, and the plurality of second holes have a lower portion having a width wider than a width of an upper portion thereof.
 8. The light emitting device of claim 1, wherein the first body includes a gap part disposed between the plurality of lead frames, and the gap part has a wider lower portion and a narrower upper portion.
 9. The light emitting device of claim 1, wherein the first and second bodies include materials different from each other.
 10. The light emitting device of claim 9, wherein the first body includes a white resin material, and the second body includes a transmissive silicon material or a transmissive epoxy resin material.
 11. The light emitting device of claim 10, wherein the first body includes a material having at least 70% of reflectance with respect to a wavelength emitted from the light emitting chip, and the second body includes a material having at least 70% of transmittance with respect to a wavelength emitted from the light emitting chip.
 12. The light emitting device of claim 1, wherein the second body includes an inner side portion being closer to the light emitting chip than an inner region of the first body and making contact with the lead frames exposed to the open region of the first body.
 13. The light emitting device of claim 1, further comprising a phosphor disposed in the first resin layer and disposed on a top surface of the light emitting chip.
 14. The light emitting device of claim 13, further comprising an optical lens disposed on the first resin layer and the second body, and a plurality of protrusions protruding from an upper portion of the second body and coupled with the optical lens.
 15. The light emitting device of claim 14, further comprising a second resin layer between the first resin layer and the optical lens.
 16. The light emitting device of claim 14, wherein the optical lens includes a concave part having an upper center concave toward the light emitting chip.
 17. The light emitting chip of claim 1, wherein the first and second bodies include a second opening spaced apart from the first opening, a bottom surface of the second opening exposes the plurality of lead frames, and a protective device is disposed on at least one of the plurality of lead frames exposed through the second opening.
 18. The light emitting device of claim 1, further comprising a transmissive adhesive layer between the first and second bodies.
 19. A light emitting device comprising: a first lead frame having a cavity; a second lead frame spaced apart from the first lead frame; a first body having a higher reflectance than transmittance, disposed on the first and second lead frames, and exposing a predetermined region of top surfaces of the first and second lead frames; a second body having a higher transmittance than reflectance, having a first opening corresponding to a central region of the first body, and disposed on a top surface of the first body; a light emitting chip disposed in a cavity of the first lead frame and electrically connected to the first and second lead frames; and a first resin layer in the cavity.
 20. The light emitting device of claim 19, wherein the first lead frame includes a first connection part exposed to the central region of the first body and a first lead part extending from the first connection part to a bottom surface of the body, and the second lead frame includes a second connection part exposed to the central region of the first body and a second lead part extending from the second connection part to the bottom surface of the body. 